Highly Energy-Efficient On-Chip Pulsed- Current-Mode Transmission Line Interconnect
نویسندگان
چکیده
System-on-a-chip (SoC) has become possible since a great number of circuit elements can be integrated into a single chip by the miniaturization technologies for Si CMOS. Network-onChip (NoC) has been investigated actively, and it is expected to be a new approach for designing the communication subsystems of SoC (Lee et al., 2008). Enormous circuit blocks are loaded onto the NoC, and on-chip networks like local area networks (LANs) in the NoC communicate among these circuit blocks. Since the performance of the NoC is strongly affected by on-chip networks, the construction of efficient on-chip communications infrastructures will be increasingly significant. Some of the important characteristics for on-chip interconnects are bandwidth, latency, and power. In particular, power saving technologies are very important in realizing Green IT (information technology). Power dissipation in on-chip networks mainly occurs at interconnects due to the increase of wiring resistance and capacitance. A significant issue is that power consumption of conventional on-chip interconnects, i.e. so-called RC lines, is proportional to the signal frequency; hence, it is very difficult to reduce energy dissipation per bit. Given the recent trend of high-speed signaling, we have to solve this problem and offer some good solutions. One solution is the use of copper lines and low-k dielectric, and these techniques have been widely applied and reduce power consumption for transmitting signals. However long interconnects still consume large power as in the case of RC lines. Another solution is the introduction of on-chip transmission line interconnects (TLIs). The applications of TLIs have been widely demonstrated. Modulation (Chang et al., 2003), pulsedcurrent-mode (Jose et al., 2006), current-mode-logic (Ito et al., 2004, 2005; Ishii et al., 2006; Gomi et al., 2004), low voltage differential signaling (Ito et al., 2007) and multi-drop (Ito et al., 2008) techniques are proposed, and these techniques enable the improvement of bandwidth, latency and extensibility of on-chip networks. Figure 1 is an image of on-chip networks with TLIs. It is also reported that TLIs have a better power efficiency than the conventional on-chip lines as the line length and signal frequency increase (Ito et al., 2004; Gomi et al., 2004; Ito et al., 2005; Ishii et al., 2006; Ito et al., 2007). Further improvement of the power efficiency at low frequencies is the design challenge in the case of on-chip TLIs. Since current-mode differential amplifiers are usually used for transmitters (Txs) and receivers (Rxs) in TLIs, Tx and Rx consume static power regardless ardless of the signal frequency. This means TLIs waste power if they are applied to paths with a low activity factor or to transmit low bit-rate signals.
منابع مشابه
Carbon Nanotube Based Delay Model For High Speed Energy Efficient on Chip Data Transmission Using: Current Mode Technique
Speed is a major concern for high density VLSI networks. In this paper the closed form delay model for current mode signalling in VLSI interconnects has been proposed with resistive load termination. RLC interconnect line is modelled using characteristic impedance of transmission line and inductive effect. The inductive effect is dominant at lower technology node is modelled into an equivalent ...
متن کاملHigh Speed Energy Efficient Signal Transmission On Global VLSI Interconnect
Article history: Received: September 15, 2010 Revised: October 10, 2010 Available online :Nov. 06, 2010 This paper suggests high speed and energy efficient current mode (CM) signaling technique for on chip data transmission. The system comprises of driver and receiver with decoding circuit. It is shown that CM signaling technique improves the delay parameter thrice compare to voltage mode signa...
متن کاملEfficient High-Speed On-Chip Global Interconnects
The continuous miniaturization of integrated circuits has opened the path towards System-on-Chip realizations. Process shrinking into the nanometer regime improves transistor performance while the delay of global interconnects, connecting circuit blocks separated by a long distance, significantly increases. In fact, global interconnects extending across a full chip can have a delay correspondin...
متن کاملAeolian Vibrations of Transmission Line Conductors with More than One Damper
To reduce the damages of aeolian vibration of conductors to the power transmission networks, the most common method is installation of Stock-bridge dampers. Estimation of the damper’s dissipated energy is an important factor in determining the number and location of installation of these types of vibration absorbers. This estimation is strongly dependent upon the assumed mode shape of the condu...
متن کاملSignaling Techniques for NoC
The gate length of a few tens of a nanometer for CMOS has become a distinct possibility due to technology scaling. Furthermore, the amount of transistors in a single die is increasing steadily over time towards gigascale integration (GSI) level. This development creates a noise and power dissipation problems into a system design. In addition to this, signaling over nanometer interconnects repre...
متن کامل